Ultrafuse PA is specially developed for FFF printing and based on BASF´s polyamide portfolio known as Ultramid®
Ultrafuse PA is suitable for a wide range of applications working within a larger temperature range than normal PA filament. BASF‘s Ultramid® grades are molding compounds on the basis of PA6, PA66 and various co-polyamides such as PA6/66.
Ultramid® is noted for its high mechanical strength, stiffness and thermal stability.
In addition, Ultramid® offers good toughness at low temperatures. Owing to its excellent properties, this material has become indispensable in almost all sectors of engineering for a wide range of different components and machine elements, as a high-grade electrical insulation material and for many special applications.
Ultrafuse PA is the translation of BASF´s Ultramid® to 3D printing space.
With Ultrafuse PA, it is possible to print semi-flexible thin parts, however it is very stiff in higher thicknesses. It has a lower melting temperature than PA6 and PA66 hence it can be printed in a lower temperature as well as it has better impact strength against PA6 and PA66 which opens up a new application field to the end-users. Depending on specific requirements, the formulation can be optimized further, and special filaments can be created.
Advantages of Ultrafuse PA
Good fatigue resistance
Low melting point makes it printable for many FFF printers
Good wear resistance/lubricity
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Polymaker CoPA Nylon, Black, 1.75mm, 750g
PolyMide™ is a family of Nylon/polyamide based filaments. Produced with Polymaker’s Warp-Free™ technology, PolyMide™ filaments deliver engineering properties intrinsic to Nylon and ease of printing. PolyMide™ CoPA is based on a copolymer of Nylon 6 and Nylon 6,6. The filament combines excellent strength, toughness, and heat resistance of up to 180°C.
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